Copper, nanopowder, 25 nm particle size (TEM)

Cat No:NIMN-0011

Description

Copper nanopowder is a highly versatile material with a wide range of applications in various fields. This product features nanoparticles with a particle size of 25 nm as determined by TEM analysis. Copper nanopowder is known for its excellent electrical and thermal conductivity, making it an essential component in the electronics, energy storage, and materials science industries. It is commonly used in the development of printed electronics, as a conductive filler in composites, and in the formulation of nanofluids for enhanced thermal management. The high surface area and reactivity of these nanoparticles also make them suitable for catalytic applications and as a precursor for other copper-based materials.

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Basic Information

Synonym(s)	Copper nanoparticles
Formula	Cu
Molecular Weight	63.55
EC Number	231-159-6
MDL number	MFCD00010965
UNSPSC Code	41141805
PubChem Substance ID	329767661
NACRES	NA.23
Quality Level	100
Form	nanopowder
Resistivity	1.673 μΩ-cm, 20°C
Particle Size	25 nm (TEM)
BP	2567 °C (lit.)
MP	1083.4 °C (lit.)
Density	8.94 g/mL at 25 °C (lit.)
SMILES string	[Cu]
InChI	1S/Cu
InChI key	RYGMFSIKBFXOCR-UHFFFAOYSA-N
Application(s)	Printed Electronics: Used in the development of conductive inks and flexible electronics. Nanofluids: Enhances thermal conductivity in heat transfer applications. Catalysis: Acts as a catalyst in various chemical reactions. Composite Materials: Serves as a conductive filler in polymer composites. Energy Storage: Utilized in the formulation of materials for solar thermal energy storage.

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